Next-gen HTC handsets to sport hybrid chassis design
Wednesday, June 15, 2011 - 13:46:51
Rumours suggest that HTC is taking a different approach to designing the shells of its next round of smartphones, moving away from the unibody metallic approach and opting instead for a combination of metal and plastic to keep things sleek and desirable.
According to reports in Digitimes, the Taiwanese mobile manufacturer has ordered advanced moulded chassis from a firm called Chenming Mold Industrial (CMI) and, as such, the current range of HTC phones which use multiple panels consisting sequentially of plastic and metal will be ditched in favour of a hybrid solution.
The main advantage of moulding a mobile from a mixture of plastic and metal is that you get the strength of the latter and the signal-improving transparency of the former. As such, reception issues will be a thing of the past and antenna placement within mobiles will be less of a trial by fire for phone companies.
The potential for creating stylish, fashionable mobiles using this new technique is also exciting observers, because so far HTC has failed to compete with Apple or Samsung when it comes to making super slim smartphones.
According to sources from within CMI there will be a first run of mobile casings produced on a large scale next month, although it was not made clear whether HTC would be the sole recipient or if perhaps a number of mobile firms have decided to start using its products.
The implications of the manufacturing date are that HTC or one of its rivals could be working on a next generation mobile which uses the hybrid plastic metal shell for release in the autumn. Some have even implied that it might be the next Google-branded handset to follow on from the Nexus S, although without confirmation this is pure speculation.
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